UT699 32-bit Fault-Tolerant SPARC V8/LEON 3FT Processor


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The UT699 is a pipelined monolithic, high-performance, faulttolerant SPARCTM V8/LEON 3FT Processor. The UT699 provides a 32-bit master/target PCI interface, including a 16 bit user I/O interface for off-chip peripherals. A compliant 2.0 AMBA bus interface integrates the on-chip LEON 3FT, SpaceWire, Ethernet, memory controller, cPCI, CAN bus, and programmable interrupt peripherals.  The UT699 is SPARC V8 compliant; compilers and kernels for SPARC V8 can therefore be used industry standard development tools. A full software development suite is available including a C/C++ cross-compiler system based on GCC and the Newlib embedded C-library.  BCC includes a small run-time kernel with interrupt support and Pthreads library. For multi-threaded applications, a SPARCTM compliant port of the eCos real-time kernel, RTEMS 4.6.5, and VxWorks 6.x/7.x is supported.


- Implemented on a 0.25m CMOS technology
- Flexible static design allows up to 66MHz clock rate
- 89 DMIPS throughput via 66MHz base clock frequency
- Internally configured clock network
- On-board programmable timers and interrupt controllers
- High-performance fully pipelined IEEE-754 FPU
- Power saving 2.5V core power supply
- 3.3V I/O compatibility
- Hardened-by-design flip-flops and memory cells
- Separate instruction and data cache architecture
- 10/100 Base-T Ethernet port for VxWorks development
- Integrated PCI 2.2 compatible core
- Four integrated multi-protocol SpaceWire nodes with two supporting the RMAP protocol
- Two CAN-compliant 2.0 bus interfaces
- Multifunctional memory controller

-40oC to +105oC operating case temperature range
Operational environment:
- Intrinsic total-dose: 100 krad(Si) and 300 krad(Si)
- SEL Immune >108 MeV-cm2/mg
Packaging options:
- 352-pin Ceramic Quad Flatpack, weight 31.5 grams
- 484-pin Ceramic Land Grid, Column Grid and Ball Grid Array packages
Standard Microcircuit Drawing 5962-08228 - QML Q and V

- Nuclear power plant controls
- Critical transportation systems
- High-altitude avionics
- Medical electronics
- X-Ray cargo scanning


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